Round wafers are history. Rectangular panel chips are the future of AI inference, advanced packaging, physical robotics, and autonomous systems. Own the category.
Semiconductor giants are shifting from 300mm round wafers to 600mm×600mm rectangular panels. 3× the die-per-panel. Lower cost. Higher yield. The substrate of AI.
Humanoid robots and embodied intelligence require custom panel-shaped compute modules. Not GPUs. Purpose-built panel silicon for torque, vision, and motion.
Self-driving vehicles need panel-format sensor fusion chips. Rectangular form factors match vehicle architecture. PanelCompute is the architecture of autonomy.
2.5D/3D integration, fan-out, and heterogeneous integration all converge on panel formats. PanelCompute is the platform, not just the process.